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Product details

PA0200-S

Availability on request

Manufacturer
Chip Quik Inc.
Category
Solder Stencils, Templates
Package
Bulk

Description

Not provided

Datasheet Not provided
Specifications
Inner Dimension
0.787" L x 0.551" W (20.00mm x 14.00mm)
Material
Stainless Steel
Mfr
Chip Quik Inc.
Number of Positions
100
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Package
Bulk
Pitch
0.026" (0.65mm)
Series
Proto-Advantage PA
Thermal Center Pad
-
Thickness
0.0040" (0.102mm)
Type
PQFP