Product image not available

Product details

BGA0006-S

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder Stencils, Templates
Package: Bulk

Description

Not provided

Datasheet Not provided

Specifications

Inner Dimension: -
Material: Stainless Steel
Mfr: Chip Quik Inc.
Number of Positions: 484
Outer Dimension: 2.600" L x 1.800" W (66.04mm x 45.72mm)
Package: Bulk
Pitch: 0.039" (1.00mm)
Series: Proto-Advantage BGA
Thermal Center Pad: -
Thickness: 0.0040" (0.102mm)
Type: BGA