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Product details

PA0199-S

Availability on request

Manufacturer
Chip Quik Inc.
Category
Solder Stencils, Templates
Package
Bulk

Description

Not provided

Datasheet Not provided
Specifications
Inner Dimension
0.945" L x 0.945" W (24.00mm x 24.00mm)
Material
Stainless Steel
Mfr
Chip Quik Inc.
Number of Positions
160
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Package
Bulk
Pitch
0.020" (0.50mm)
Series
Proto-Advantage PA
Thermal Center Pad
-
Thickness
0.0040" (0.102mm)
Type
TQFP