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Product details

PA0190-S

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder Stencils, Templates
Package: Bulk

Description

Not provided

Datasheet Not provided

Specifications

Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Material: Stainless Steel
Mfr: Chip Quik Inc.
Number of Positions: 128
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Package: Bulk
Pitch: 0.016" (0.40mm)
Series: Proto-Advantage PA
Thermal Center Pad: -
Thickness: 0.0040" (0.102mm)
Type: TQFP