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Product details

IPC0117-S

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder Stencils, Templates
Package: Bulk

Description

Not provided

Datasheet Not provided

Specifications

Inner Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Material: Stainless Steel
Mfr: Chip Quik Inc.
Number of Positions: 14
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Package: Bulk
Pitch: 0.020" (0.50mm)
Series: Proto-Advantage IPC
Thermal Center Pad: 0.083" L x 0.055" W (2.10mm x 1.40mm)
Thickness: 0.0040" (0.102mm)
Type: QFN/LFCSP