Product image not available

Product details

PA0185-S

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder Stencils, Templates
Package: Bulk

Description

Not provided

Datasheet Not provided

Specifications

Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Material: Stainless Steel
Mfr: Chip Quik Inc.
Number of Positions: 5
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Package: Bulk
Pitch: 0.067" (1.70mm)
Series: Proto-Advantage PA
Thermal Center Pad: 0.433" L x 0.394" W (11.00mm x 10.00mm)
Thickness: 0.0040" (0.102mm)
Type: TO/DDPAK