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Product details

PA0193-S

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder Stencils, Templates
Package: Bulk

Description

Not provided

Datasheet Not provided

Specifications

Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Material: Stainless Steel
Mfr: Chip Quik Inc.
Number of Positions: 16
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Package: Bulk
Pitch: 0.026" (0.65mm)
Series: Proto-Advantage PA
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Thickness: 0.0040" (0.102mm)
Type: TSSOP