Product image not available

Product details

BGA0036-S

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder Stencils, Templates
Package: Bulk

Description

Not provided

Datasheet Not provided

Specifications

Inner Dimension: 0.512" L x 0.512" W (13.00mm x 13.00mm)
Material: Stainless Steel
Mfr: Chip Quik Inc.
Number of Positions: 169
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Package: Bulk
Pitch: 0.029" (0.75mm)
Series: Proto-Advantage BGA
Thermal Center Pad: -
Thickness: -
Type: BGA