Component records

Adhesives, Epoxies, Greases, Pastes

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546 component records

Shiu Li Technology Co., Ltd.

SH-PUTTY3-100-KIT

THERMAL PUTTY 100G PLUS APPLICAT

Availability on request

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TC-2707

THRMLY COND ADH 200 ML DUO-PAK

Availability on request

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TC-2707 37ML

THERM COND ADH TC-2707 37 ML

Availability on request

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TC-2707 50ML

ADHESIVE THERM COND 50ML

Availability on request

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Gelid Solutions LLC

TC-GC-03-02

THERMAL COMPOUND 10GR, 8.5W

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Gelid Solutions LLC

TC-GC-03-A

THERMAL COMPOUND 3.5GR, 8.5W

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Gelid Solutions LLC

TC-GC-03-D

THERMAL COMPOUND 1GR, 8.5W

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Chip Quik Inc.

TC1-10G

HEAT SINK COMPOUND - HIGH DENSIT

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Chip Quik Inc.

TC1-200G

HEAT SINK COMPOUND - HIGH DENSIT

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Chip Quik Inc.

TC1-20G

HEAT SINK COMPOUND - HIGH DENSIT

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Chip Quik Inc.

TC2-10G

HEAT SINK COMPOUND - GREY ULTRA

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Chip Quik Inc.

TC2-20G

HEAT SINK COMPOUND - GREY ULTRA

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Chip Quik Inc.

TC2-50G

HEAT SINK COMPOUND - GREY ULTRA

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TC2810 37ML

THERM COND ADH TC-2810 37 ML

Availability on request

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TC2810 50ML

ADHESIVE 2-PART EPOXY 50ML

Availability on request

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Chip Quik Inc.

TC3-10G

HEAT SINK THERMAL COMPOUND

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Chip Quik Inc.

TC3-1G

HEAT SINK THERMAL COMPOUND

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Chip Quik Inc.

TC3-3.5G

HEAT SINK THERMAL COMPOUND

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Chip Quik Inc.

TC4-10G

HEAT SINK THERMAL COMPOUND - DEE

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Chip Quik Inc.

TC4-1G

HEAT SINK THERMAL COMPOUND - DEE

Availability on request

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Electronic component records