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Product details

SMD2055-25000

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder
Package: Jar

Description

Lead Free Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar

Datasheet Not provided

Specifications

Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.025" (0.64mm)
Digi-Key Storage: -
Flux Type: -
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Mfr: Chip Quik Inc.
Package: Jar
Process: Lead Free
Series: SMD2
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: -
Type: Solder Sphere
Wire Gauge: -