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SMD2060-25000 product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

SMD2060-25000

Availability on request

Manufacturer
Chip Quik Inc.
Category
Solder
Package
Jar

Description

Lead Free Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar

Datasheet Not provided
Specifications
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.030" (0.76mm)
Digi-Key Storage
-
Flux Type
-
Form
Jar
Melting Point
423 ~ 428°F (217 ~ 220°C)
Mfr
Chip Quik Inc.
Package
Jar
Process
Lead Free
Series
SMD2
Shelf Life
24 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Type
Solder Sphere
Wire Gauge
-