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Product details

XC7Z035-2FFV676E

Availability on request

Manufacturer
AMD Xilinx
Category
System On Chip (SoC)
Package
Bulk

Description

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 800MHz 676-FCBGA (27x27)

Datasheet Not provided
Specifications
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size
-
Mfr
AMD Xilinx
Number of I/O
130
Operating Temperature
0°C ~ 100°C (TJ)
Package
Bulk
Package / Case
676-BBGA, FCBGA
Peripherals
DMA
Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
RAM Size
256KB
Series
Zynq®-7000
Speed
800MHz
Supplier Device Package
676-FCBGA (27x27)

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