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Product details

MMF006630

Availability on request

Manufacturer
Micro-Measurements (Division of Vishay Precision Group)
Category
Solder
Package
Jar

Description

Lead Free Solder Paste Ag40Cu30Zn28Ni2 (40/30/28/2) Jar, 1 oz (28g)

Datasheet Not provided
Specifications
Composition
Ag40Cu30Zn28Ni2 (40/30/28/2)
Diameter
-
Flux Type
-
Form
Jar, 1 oz (28g)
Melting Point
1220 ~ 1435°F (660 ~ 780°C)
Mesh Type
-
Mfr
Micro-Measurements (Division of Vishay Precision Group)
Package
Jar
Process
Lead Free
Series
-
Shelf Life
9 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
41°F ~ 77°F (5°C ~ 25°C)
Type
Solder Paste
Wire Gauge
-