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Product details

412183

Availability on request

Manufacturer: Harimatec Inc.
Category: Solder
Package: Bulk

Description

Lead Free No-Clean Wire Solder Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) 18 AWG, 19 SWG Spool, 1 lb (454 g)

Datasheet Not provided

Specifications

Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Diameter: 0.040" (1.02mm)
Flux Type: No-Clean
Form: Spool, 1 lb (454 g)
Melting Point: 423°F (217°C)
Mfr: Harimatec Inc.
Package: Bulk
Process: Lead Free
Series: C511™
Shelf Life: -
Shelf Life Start: -
Shipping Info: -
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Type: Wire Solder
Wire Gauge: 18 AWG, 19 SWG