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Product details

1769647

Availability on request

Manufacturer: Harimatec Inc.
Category: Solder
Package: Bulk

Description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 21.16 oz (600g)

Datasheet Not provided

Specifications

Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: -
Digi-Key Storage: -
Flux Type: No-Clean
Form: Jar, 21.16 oz (600g)
Melting Point: 423°F (217°C)
Mesh Type: -
Mfr: Harimatec Inc.
Package: Bulk
Process: Lead Free
Series: HF212
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Shipping Info: -
Storage/Refrigeration Temperature: -
Type: Solder Paste
Wire Gauge: -