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M2S090T-FG676 package illustration

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Product details

M2S090T-FG676

Availability on request

Manufacturer
Microchip Technology
Category
System On Chip (SoC)
Package
676-FBGA (27x27)

Description

ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)

Specifications
Architecture
MCU, FPGA
Base Product Number
M2S090
Connectivity
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Core Processor
ARM® Cortex®-M3
Flash Size
512KB
Mfr
Microchip Technology
Number of I/O
425
Operating Temperature
0°C ~ 85°C (TJ)
Package
Tray
Package / Case
676-BGA
Peripherals
DDR, PCIe, SERDES
Primary Attributes
FPGA - 90K Logic Modules
RAM Size
64KB
Series
SmartFusion®2
Speed
166MHz
Supplier Device Package
676-FBGA (27x27)