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Product details

24-3552-16

Availability on request

Manufacturer: Aries Electronics
Category: IC Sockets
Package: Bulk

Description

24 (2 x 12) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole

Datasheet Not provided

Specifications

Base Product Number: 24-3552
Contact Finish - Mating: Nickel Boron
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Contact Material - Post: Beryllium Copper
Contact Resistance: -
Current Rating (Amps): 1 A
Features: Closed Frame
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating: UL94 V-0
Mfr: Aries Electronics
Mounting Type: Through Hole
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -
Package: Bulk
Pitch - Mating: 0.100" (2.54mm)
Pitch - Post: 0.100" (2.54mm)
Series: 55
Termination: Solder
Termination Post Length: 0.110" (2.78mm)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing