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DS34S132GNA2+ product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

DS34S132GNA2+

Availability on request

Manufacturer
Analog Devices Inc./Maxim Integrated
Category
Telecom
Package
Tray

Description

Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)

Specifications
Base Product Number
DS34S132
Current - Supply
-
Function
TDM-over-Packet (TDMoP)
Interface
TDMoP
Mfr
Analog Devices Inc./Maxim Integrated
Mounting Type
Surface Mount
Number of Circuits
1
Operating Temperature
-40°C ~ 85°C
Package
Tray
Package / Case
676-BGA
Series
-
Supplier Device Package
676-TEPBGA (27x27)
Voltage - Supply
1.8V, 3.3V