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CYW15G0403DXB-BGC product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

CYW15G0403DXB-BGC

Availability on request

Manufacturer
Infineon Technologies
Category
Telecom
Package
Tray

Description

Telecom IC 256-L2BGA (27x27)

Datasheet Not provided
Specifications
Base Product Number
CYW15G0403
Current - Supply
-
Function
-
Interface
-
Mfr
Infineon Technologies
Mounting Type
Surface Mount
Number of Circuits
4
Operating Temperature
-
Package
Tray
Package / Case
256-BGA Exposed Pad
Series
HOTlink II™
Supplier Device Package
256-L2BGA (27x27)
Voltage - Supply
3.135V ~ 3.465V

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