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Product details

SMDSWLF.004 20G

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder
Package: Bulk

Description

Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.7 oz (20g)

Datasheet Not provided

Specifications

Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.004" (0.10mm)
Flux Type: -
Form: Spool, 0.7 oz (20g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Mfr: Chip Quik Inc.
Package: Bulk
Process: -
Series: -
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Shipping Info: -
Storage/Refrigeration Temperature: -
Type: Wire Solder
Weight: -
Wire Gauge: -