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Kester Solder
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Product details
SMD4300LTLFP250T4
Availability on request
Description
Leaded No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Datasheet
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Specifications
- Composition
- Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter
- -
- Flux Type
- No-Clean
- Form
- Jar, 8.8 oz (250g)
- Melting Point
- 280°F (138°C)
- Mfr
- Chip Quik Inc.
- Package
- Bulk
- Process
- Leaded
- Series
- -
- Shelf Life
- 6 Months
- Shelf Life Start
- Date of Manufacture
- Shipping Info
- -
- Storage/Refrigeration Temperature
- 32°F ~ 77°F (0°C ~ 25°C)
- Type
- Solder Paste
- Weight
- -
- Wire Gauge
- -
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