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Product details

NC191LTA250T5

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder
Package: Bulk

Description

No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Jar, 8.8 oz (250g)

Datasheet Not provided

Specifications

Base Product Number: NC191
Composition: Bi57Sn42Ag1 (57/42/1)
Diameter: -
Flux Type: No-Clean
Form: Jar, 8.8 oz (250g)
Melting Point: 279°F (137°C)
Mesh Type: 5
Mfr: Chip Quik Inc.
Package: Bulk
Process: -
Series: Smooth Flow™
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Type: Solder Paste
Wire Gauge: -