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Product details

NC191LTA35T5

Availability on request

Manufacturer
Chip Quik Inc.
Category
Solder
Package
Bulk

Description

No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Syringe, 1.23 oz (35g), 10cc

Datasheet Not provided
Specifications
Base Product Number
NC191
Composition
Bi57Sn42Ag1 (57/42/1)
Diameter
-
Flux Type
No-Clean
Form
Syringe, 1.23 oz (35g), 10cc
Melting Point
279°F (137°C)
Mesh Type
5
Mfr
Chip Quik Inc.
Package
Bulk
Process
-
Series
Smooth Flow™
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Type
Solder Paste
Wire Gauge
-