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Product details

EXB-SN96.5AG3.0CU0.5-0.5LB

Availability on request

Manufacturer
Chip Quik Inc.
Category
Solder
Package
Bulk

Description

Leaded Bar Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Bar, 0.5 lb (227g)

Datasheet Not provided
Specifications
Base Product Number
EXB-SN96
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Flux Type
-
Form
Bar, 0.5 lb (227g)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Mfr
Chip Quik Inc.
Package
Bulk
Process
Leaded
Series
Super Low Dross™
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
-
Type
Bar Solder
Wire Gauge
-