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LPC2292FET144/01 package illustration

Generic BGA package illustration, not an exact-model photograph; pictured ball arrangement and details may differ. Image shown for reference only. Refer to the product datasheet for exact specifications. 所示图片仅供参考。确切规格请参考产品数据手册即可

Product details

LPC2292FET144/01

Availability on request

Manufacturer
NXP USA Inc.
Category
Microcontrollers
Package
144-TFBGA (12x12)

Description

ARM7® LPC2200 Microcontroller IC 16/32-Bit 60MHz 256KB (256K x 8) FLASH 144-TFBGA (12x12)

Datasheet View datasheet (opens in a new window)
Specifications
Base Product Number
LPC2292
Connectivity
CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Core Processor
ARM7®
Core Size
16/32-Bit
Data Converters
A/D 8x10b
EEPROM Size
-
Mfr
NXP USA Inc.
Mounting Type
Surface Mount
Number of I/O
112
Operating Temperature
-40°C ~ 85°C (TA)
Oscillator Type
Internal
Package
Bulk
Package / Case
144-TFBGA
Peripherals
POR, PWM, WDT
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
RAM Size
16K x 8
Series
LPC2200
Speed
60MHz
Supplier Device Package
144-TFBGA (12x12)
Voltage - Supply (Vcc/Vdd)
1.65V ~ 3.6V

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