NC191LT35 product image

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Product details

NC191LT35

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder
Package: Bulk

Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc

Datasheet Not provided

Specifications

Base Product Number: NC191
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: -
Flux Type: No-Clean
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 280°F (138°C)
Mesh Type: 4
Mfr: Chip Quik Inc.
Package: Bulk
Process: Lead Free
Series: Smooth Flow™
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Type: Solder Paste
Wire Gauge: -