NC191SNL50T5 product image

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Product details

NC191SNL50T5

Availability on request

Manufacturer: Chip Quik Inc.
Category: Solder
Package: Bulk

Description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)

Datasheet Not provided

Specifications

Base Product Number: NC191
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: -
Flux Type: No-Clean
Form: Jar, 1.76 oz (50g)
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Mesh Type: 5
Mfr: Chip Quik Inc.
Package: Bulk
Process: Lead Free
Series: Smooth Flow™
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Type: Solder Paste
Wire Gauge: -