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NC191LT50T5 product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

NC191LT50T5

Availability on request

Manufacturer
Chip Quik Inc.
Category
Solder
Package
Bulk

Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)

Datasheet Not provided
Specifications
Base Product Number
NC191
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Digi-Key Storage
Refrigerated
Flux Type
No-Clean
Form
Jar, 1.76 oz (50g)
Melting Point
280°F (138°C)
Mesh Type
5
Mfr
Chip Quik Inc.
Package
Bulk
Process
Lead Free
Series
Smooth Flow™
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Type
Solder Paste
Wire Gauge
-

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