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APO-308-G-H product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

APO-308-G-H

Availability on request

Manufacturer
Samtec Inc.
Category
IC Sockets
Package
Bulk

Description

8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Datasheet Not provided
Specifications
Base Product Number
APO-308
Contact Finish - Mating
Gold
Contact Finish - Post
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Mating
Phosphor Bronze
Contact Material - Post
Phosphor Bronze
Contact Resistance
-
Features
Open Frame
Housing Material
Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating
UL94 V-0
Mfr
Samtec Inc.
Mounting Type
Through Hole
Number of Positions or Pins (Grid)
8 (2 x 4)
Operating Temperature
-
Package
Bulk
Pitch - Mating
0.100" (2.54mm)
Pitch - Post
0.100" (2.54mm)
Series
APO
Termination
Solder
Termination Post Length
-
Type
DIP, 0.3" (7.62mm) Row Spacing