|
Compare |
Mfr Part # |
RoHS |
Pricing(USD) |
Inventory |
Description |
Package |
|
Quantity |
Part Status |
|---|---|---|---|---|---|---|---|---|---|
HSIB897-BGA-1
iBASE Technology |
|
8969 | AC, HEAT SPREADER FOR IB897, (RO | Box |
|
Active | |||
HSIB899-BGA-A
iBASE Technology |
|
8411 | AC, HEATSINK FOR IB899 SERIES, ( | Box |
|
Active | |||
HSET930-BGA-1
iBASE Technology |
|
4726 | HEATSINK WITH COOLER FOR ET930 ( | Box |
|
Active | |||
HSIB908-BGA-1
iBASE Technology |
|
6182 | AC, HEATSINK FOR IB908 ONLY , (R | Box |
|
Active | |||
HSE-B2111-038
CUI Devices |
|
9816 | HEAT SINK, EXTRUSION, TO-220, 25 | Box |
|
Active | |||
HSS-B20-NP-12
CUI Devices |
|
6071 | HEATSINK TO-220 6.8W ALUMINUM | Bag |
|
Active | |||
HSS-B20-NP-04
CUI Devices |
|
3825 | HEATSINK TO-220 6.5W ALUMINUM | Box |
|
Active | |||
HSS11-B20-P38
CUI Devices |
|
4502 | HEAT SINK, STAMPING, TO-220, 50. | Box |
|
Active | |||
HSS-B20-0503H
CUI Devices |
|
4539 | HEATSINK TO-220 4.6W ALUMINUM | Box |
|
Active | |||
HSS26-B20-P38
CUI Devices |
|
8257 | HEAT SINK, STAMPING, TO-218/TO-2 | Bag |
|
Active | |||
HSS15-B20-P40
CUI Devices |
|
7868 | HEAT SINK, STAMPING, TO-220, 23. | Box |
|
Active | |||
HSS-B20-NP-06
CUI Devices |
|
9281 | HEATSINK TO-220 2.9W ALUMINUM | Bag |
|
Active | |||
HSE01-193175P
CUI Devices |
|
5311 | HEAT SINK, EXTRUSION, 19 X 31.5 | Box |
|
Active | |||
HSE02-173213P
CUI Devices |
|
5579 | HEAT SINK, EXTRUSION, 17 X 31.9 | Box |
|
Active | |||
HSS-B20-CP-01
CUI Devices |
|
7201 | HEATSINK TO-220 2.6W ALUMINUM | Box |
|
Active | |||
HSS27-B20-P43
CUI Devices |
|
8675 | HEAT SINK, STAMPING, TO-218/TO-2 | Bag |
|
Active | |||
HSS-B20-NP-07
CUI Devices |
|
6568 | HEATSINK TO-220 2.3W ALUMINUM | Bag |
|
Active | |||
HSS-B20-NP-15
CUI Devices |
|
5414 | HEATSINK TO-220 4.1W ALUMINUM | Bag |
|
Active | |||
HSS-B20-NP-10
CUI Devices |
|
4635 | HEATSINK TO-220 2.9W ALUMINUM | Bag |
|
Active | |||
HSS06-C20-P32
CUI Devices |
|
7453 | HEAT SINK, STAMPING, TO-220, 27. | Box |
|
Active |



